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1～13 件を表示 ／ 全 13 件
Semiconductor industry (visual inspection)
This is a device that creates mapping data using a line camera after setting the wafer chips on the XYθ stage, and then simultaneously inspects multiple chips with a high-resolution area camera.
Achieve a stable posture and realize high-speed inspection.
Appearance inspection device that transports microchip components supplied by P/F using a rotor with a V-shaped groove and performs six-sided appearance inspection.
Simultaneous inspection of front and back possible! A wafer and chip appearance inspection machine that can perform both macro and micro inspections with one unit. Suitable for LED and semiconductor chips.
The "Wafer Chip Appearance Inspection System HM-256 Series" features a standard 3CMOS 3.2 million pixel color camera, providing excellent detection capabilities and enabling high-speed inspection of chip appearances after wafer and dicing processes. It can inspect appearance defects that occur during the wafer and dicing processes with high speed and precision, allowing for the inspection of various chip patterns. 【Features】 ■ Inspection with variable image resolution (1.5 to 5µ) for each type ■ Inspection at sub-micron resolution possible with an embedded microscope (optional) ■ Defect classification based on complex conditions of image features ■ Inspection using multiple recipes (different image resolutions, lighting, and judgment programs) in a single run *For more details, please download the catalog or feel free to contact us.
Automating defect inspection with high precision! Achieving no visual inspection through the automation of inspection on all six sides!
This is an appearance inspection device that automates defect inspection of power device chips with high precision. By automating the inspection of all six surfaces, it achieves 2D high-precision defect inspection without visual inspection (target products: chips for IGBTs, power diodes, etc.). In side inspections, focus shifts caused by XYθ misalignment are corrected for each workpiece, ensuring that fine defects are reliably detected with just the right focus. For top and bottom inspections, multi-angle lighting combined with multiple imaging captures inspection images suitable for various defect modes, ensuring that targeted defects are reliably detected. 【Features】 ■ High resolution: High-resolution inspection with a maximum 25Mpix camera ■ Suitable lighting environment: Multi-angle lighting ■ High-speed control and capture: Continuous capture of multiple optimal images for each defect mode *For more details, please refer to the PDF document or feel free to contact us.
Multi-faceted and compatible with various sizes.
Multi-surface chip appearance inspection device that enables high-precision inspection.
It is possible to inspect appearance defects occurring in the wafer process and dicing process quickly and with high precision.
The "Low-Cost Version Wafer and Chip Appearance Inspection System HMWF-A2000" is an appearance inspection device equipped with a high-resolution color camera, providing excellent detection capabilities and enabling high-speed inspection of chip appearances after wafer processing and dicing. It can inspect appearance defects occurring in the wafer and dicing processes with high speed and precision, and is capable of inspecting a variety of chip patterns. 【Features】 ■ Capable of inspecting a variety of chip patterns. ■ Can capture features for each defect item through image processing and classify defects (categorization function). ■ The accumulated software technology significantly reduces the total cost of the device. *For more details, please contact us or download the catalog to view.
Equipped with a variety of functions! Inspections are conducted using a 3CMOS color area camera with 3.2 million pixels.
The "Wafer Chip Appearance Inspection Device (Post-Dicing)" is a device for inspecting the appearance of chips after wafer dicing. Image resolution can be selected according to inspection accuracy (approximately 0.8μm to 2.0μm/pixel). Additionally, optional features include simultaneous front and back inspection, NG chip reject function, NG chip marking function, elimination of all errors, marking error check function, ID reading, and mapping data output function. 【Features】 ■ Multifunctional image inspection software Hu-Dra ■ A two-stage specification that allows for simultaneous appearance inspection and NG rejection is also available ■ Processing capabilities - Appearance inspection time: approximately 2 minutes at a resolution of 1.5μm (2-inch: chip size approximately 1mm) - Elimination time: 3 to 6 chips per second (varies depending on chip size and type of sheet) - Marking time: 3 to 4 chips per second for inker *For more details, please refer to the PDF document or feel free to contact us.
A wide variety of products are featured, including inspection equipment, joining materials, and wafer processing equipment!
This catalog features the product lineup handled by the post-process department. We offer a wide range of products, including the "Wafer and Chip Appearance Inspection Equipment" compatible with 2-inch to 12-inch sizes, as well as "N2 Compact Size Reflow" and "Solder Paste." [Featured Products (Excerpt)] ■ Inspection Equipment ■ Reflow Equipment ■ Joining Materials ■ Cleaning Equipment ■ Wafer Process Equipment ■ Others *For more details, please refer to the PDF document or feel free to contact us.
By conducting a complete visual inspection of the chips before implementation, we can reduce losses in subsequent processes and improve yield! Ideal for acceptance inspection and screening in module assembly!
The "CI Series" is a device that conducts visual quality inspections of individual bare chips stored in a chip tray, classifying them as good or defective. Detection examples include edge cracks, chipping, scratches, foreign matter adhesion, discoloration, etc. Using the standard multi-angle lighting, it is possible to set lighting conditions that capture various defect modes that appear on the product. This device is suitable for pre-shipment inspections by semiconductor bare chip manufacturers and contract manufacturers. Examples of target products include power devices, ICs, image sensors, and wafer chips for various sensors. <CI8000> - Six-sided inspection model (inspection of all six sides: front, back, and sides) - Fastest processing capability of 8000 CPH - Equipped with a stage that enables high-resolution inspections <CI200i> - Front and back inspection model - Space-saving by conducting surface inspection in the tray - Minimizes contact with the product, ensuring no damage - Equipped with a high-resolution inspection stage *For more details, please refer to the PDF document or feel free to contact us.
